ZiNIR introduces Solo® Spectroscopy

ZiNIR Limited is focused on the development and commercialisation of Solo Spectroscopy, a novel semiconductor chip-based spectrometer consisting of an array of microdisk resonators evanescently coupled to a central waveguide. Unlike grating-based or FTIR spectroscopy, Solo Spectroscopy uses a single component to perform both wavelength selection and detection functions.

The spectrometer chip is a monolithic structure formed from a single semiconductor heterostructure and is manufactured using standard semiconductor fabrication processes. The main benefits of this approach include:

  • Huge economies of scale from the mass manufacture of semiconductor chips which enables the same spectroscopy budget to develop built-in redundancy in challenging locations, dispersed spectrometer networks and multiple chip arrays.
  • Minuscule, low mass for either covert operation, small spaces or 3D imaging with a spectrometer chip array in hyperspectral imaging & remote sensing.
  • High performance spectroscopy capable of delivering wide area imaging at high spectral resolution (1nm Nyquist). Solo Spectroscopy offers enhanced spectral properties due to the potential for low stray light as well as fast data acquisition.
  • Highly robust spectrometer chips since there are no electrically or mechanically moving parts or separate wavelength selection and detection components.
  • Inherently low power budget due to novel approach and low mass
  • Thermal stability since Solo Spectroscopy chips use III-V semiconductor materials rather than silicon they can withstand temperatures -200°C to 200°C.
  • Dynamically configurable functionality allows light throughput and spectral resolution to be modified mid-operation, according to the application.

Technical Parameters

Resolution: Currently <1nm Nyquist. 0.1nm expected with design optimisation.
Speed of data gathering: >10kHz
Power consumption: (passive system) : <1W for chip & <5W for sub-system.
Size of chip: <1mm along each axis, ≈100 micron thick with mass of micrograms.
Size of packaged chip with electronics: ≈1cm2, ≈3mm thick.
Temperature range: can be designed to operate between -200°C and +200°C depending on wavelength range of interest.
Operational range: initially in Near Infrared but potential for UV to Mid-IR due to generic technological approach.